柔性封裝機器人
柔性封裝機器人是專用的自動封裝設備，主要針對MEMS（Micro Electro Mechanical systems的縮寫，即微電子機械系統(tǒng)）應用于小批量、多品種傳感器的自動封裝而研制開發(fā)，可針對各傳感器特點，通過夾具的柔性設計完成不同類型傳感器的封裝。
Flexible Encapsulation Robot is an exclusive Automatic Encapsulation Equipment. It aims at MEMS( Micro Electro Mechanical Systems) and is developed and applied to the Auto-Encapsulation of small lot and various kinds of sensors. It encapsulates various kinds of sensors with the flexible design of fixtures according the characeristic of sensors
1、應用領域：MEMS產(chǎn)業(yè)發(fā)展特點是小批量、多品種，柔性封裝機器人適應多種MEMS傳感器的封裝。Application area: Small lot and various categories is the characteristic of MEMS industry. The Flexible Encapsulation Robot is adopted to kinds of MEMS sensor encapsulation.
2、關鍵技術 Key Technology
1)自動定位：采用自動變倍顯微鏡實現(xiàn)大范圍、高精度位置測量。解決了變倍自動調(diào)焦、顯微圖像分割等關鍵問題，可實現(xiàn)柔性封裝前的自動定位；Auto-positioning: apply the auto-zooming microscope to realize the large-scale and high accurate position measurement. Figure out the key question of zooming auto-facusing and micro image segmentation. Realize the auto-positioning before the encapsulation.
2)定位精度高：采用精密步進電機驅(qū)動，可實現(xiàn)定位精度5μm；High accuracy of positioning: driven by the accurate stepper motor ; 5μm high accurate positioning.
3)溫度控制范圍寬、控制著精度高：接合工藝爐采用基于PID調(diào)節(jié)技術的溫度控制方式，可實現(xiàn)0-500度范圍內(nèi)的溫度調(diào)整和控制。Wide scale of temperature control and high accuracy control: the combiner applys the PID-based adjusting technology, tuning and controling the temperature within 0~500°C.
4)人機界面友好：基于計算機控制方式，實現(xiàn)全部節(jié)拍的安排、動作的設置和信息的采集，提供良好的人機界面。Friendly Human-computer interface: Base on the computer control; carry out the all beats scheduling, motion setup and information collocting; provide friendly human computer interface.
3、功能：將精密定位、顯微視覺、作業(yè)工具等關鍵技術有機結(jié)合，通過模塊化設計，可根據(jù)需求有效集成，滿足不同封裝要求。Function: combining organically the key technology of accurate positioning, mircro visual and operating tools, adopting the modular design, different encapsolation requires are satisfied according effetive intergration.
4、實際應用 Practical Application
（1）、已實現(xiàn)MEMS高溫壓力傳感器自動化組裝作業(yè)。MEMS high-temperature pressure sensor auto-encapsulation has been realized
（2）、實現(xiàn)加速度計、微麥克風等傳感器的引線鍵合封裝。Accelerometer and tiny microphone sensors’ lead bonding encapsulation has been realized
5、樣機照片 Product sample
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